QUALCOMM ships first chipsets for Snapdragon platform

The QSD8250 and QSD8650 enable high degrees of multimedia performance for mobile devices.
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QUALCOMM is now shipping the first chipset products from the Snapdragon platform, the QSD8250 and QSD8650. They are designed to provide high levels of mobile data processing and multimedia performance, along with low power consumption.

The QSD8250 supports HSPA data rates of up to 7.2Mb/s on the downlink and 5.76Mb/s on the uplink, with full backward compatibility. The dual-mode QSD8650 supports HSPA, as well as CDMA2000 1xEvDO Rev. B, with full backward compatibility. The two solutions feature a custom gigahertz microprocessor core paired with QUALCOMM’s sixth-generation DSP core running at 600MHz.

For more information, visit www.cdmatech.com/snapdragon and www.qualcomm.com.