Mobile DTV Chipmaker Siano Secures $23.5 Million
NETANYA, ISRAEL: Siano Mobile Silicon completed a fourth round
of funding that raised $23.5 million for the company. The round consisted
exclusively of all of Siano’s existing investors: JVP, DFJ-Tamir-Fishman, Star
Ventures, Walden Israel, and Bessemer Venture Partners. The fourth round of
funding brings the company’s total to $75.5 million.
Siano develops and markets semiconductor chips for reception of digital TV on
mobile, portable and hand-held devices for standards in China, Brazil and
Europe. These include DVB-T/H, T-TMB, DAB/DAB+ and ISDB-T. It does not list the
U.S. standard for mobile DTV, ATSC M/H among those it serves.
“The new funds will help Siano solidify this position, build sufficient product
inventory to secure vast supply, and in parallel continue to develop new products
and penetrate new markets,” said Siano CEO Alon Ironi.